|
※Advantages
hBN hot pressed solids is used for
substrates for mounting high density and high power electronic components
where the high thermal conductivity achieved allows efficient heat
dissipation.
Hot-pressed BN is compacted at
temperatures up to 2000℃. Currently TSD offers low pressure
hot-pressed BN, but will soon offering height pressure hot-pressed BN.
Hot-pressed BN can result in limited thermal shock resistance.
※Hexagonal
Boron Nitride Characteristics:
|
 |
High thermal conductivity |
|
High electrical resistance |
|
|
High thermal shock resistance |
|
Corrosion and oxidization resistance |
|
|
Chemically inert |
|
Low loss tangent and low dielectric
constant |
|
|
Excellent radiated heat transfer |
|
|
※Applications
|
■ |
Heat sink in
transistor packages |
|
■ |
Insulators |
※產品規格
|
|
Boron nitride |
Aluminum oxide |
|
Dielectric constant |
4.2 |
9.7 |
|
Thermal conductivity
at RT W/mK |
55~70 |
33 |
|
