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※Advantage
The BN silicon thermal pads offer another
solution to thermal interface material achieving 4.77 W/mK thermal
conductivity.
※Features
and Benefits
■ High thermal
conductivity of 4.7 W/mK
■ Low thermal
resistance
■ Thickness –
Varies from 0.45mm ~ 1.5mm
※Applications
■ Power
conversion equipment
■ Power
components
■ Notebook
computers
■ CPU
■ GPU
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